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Engineering

Design Guidelines

In order for a circuit board to be properly manufactured, the design has to adhere to specific guidelines. The following are general requirements for you to use as a guide to ensure that the design can be manufactured into a finished product.

  STANDARD ADVANCED
Maximum layer Count 20 layers up to 40 layers
Minimum trace width    
½ oz copper .005" .003"
1 oz copper .007" .004"
2 oz copper .010" .008"
Minimum space    
½ oz copper .006" .004"
1 oz copper .007" .004"
2 oz copper .010" .006"
Minimum finished via hole size .010" .005"
Minimum finished via pad size .025" .018"
Maximum drill aspect ratio 8 to 1 16 to 1
Controlled impedance tolerance +/-10% +/-5%
Minimum thickness tolerance +/-10% or .007" +/-5% or .004"
Minimum finished boards thickness .031" .012"
Minimum Plated through hole tolerance +/-.003" +/-.002"
Minimum Non plated hole tolerance +/-.002" +/-.001"
Minimum routing tolerance +/-.005" +/-.003"
Minimum warpage tolerance .010" / inch .005"/ inch
Minimum solder mask clearance .005" .002"
Minimum internal clearance .012" .008"
Minimum dielectric spacing .005" .002"
Legend line width .010" .006"


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