Event Snippet:

Assembly

PCB Assembly Circuit Board Assembly
PCB Assembly

Overview

  • 100% 3D X-ray Inspection after SMT and at Final QA on every leadless part to ensure no shorts, opens, or voids are present
  • Content 100% Inline AOI ensures no errors with parts placement, mis-alignment, mis-orientation, and solder joint defects
  • 12 zone ovens with on-demand Liquid Nitrogen for 99.99% purity on solder joints
  • Dual wave and Selective wave Soldering Machines
  • 100% Inline Solder Paste Inspection
  • First article QA Inspection done on every job
  • Flying Probe Test
  • Parametric Bench Test
Quick-Turn Capabilities
SPI and AOI
X-ray and Flying Probe

Gorilla Circuits provides excellent lead time capability. We have eliminated all line-down time though a streamlined process that is enabled through parts procurement, programming and the ability to set up multiple jobs offline with Fuji’s revolutionary feeder carts.

Gorilla Circuits performs 100% Automated Optical Inspection on every assembly to detect any errors that may result from incorrect parts placement, misalignment, improper orientation or solder joint defects. We use the TR7007 SII, which offers the fastest Solder Paste Inspection system in the industry at speeds of 200 cm2/second.

100% X-ray inspection is always done twice; first at SMT stage and again at FQA stage, on every leadless device to ensure the absence of shorts, opens and voids.

Virtual Tour

Capabilities

  • State-of-the-art 35k sq/ft facility in San Jose
  • 24 Hour builds available
  • Front end engineering services for DFM review
  • 12 Zone Ovens with ON-Demand Liquid Nitrogen for 99.99% purity on solder joints

Lead Times

  • Standard leads times range from 3-5 Days
  • 24 Hour expedites are available

Parts Procurement & Inventory

  • Parts Procurement team and Parts Inventory available

FUJI Pick and Place

Testing

  • 100% Inline Solder Paste Inspection
  • First Article QA inspection done on every job
  • Flying Probe Test
  • Parametric Bench Test
  • 100% 3D Xray Inspection after SMT and at Final QA on every leadless part to insure no shorts, opens or voids are present
  • 100% Inline AOI insures no errors with parts placement, mis-alignment, mis-orientation, and solder joint defects

Solder Paste Inspection

SEICA Test Solutions Pilot V8 4D:

  • Maximum board size 30″ x 30″
  • Configured with 4 probes front side and 4 rear side moving probes
  • TOS SEICA Pilot V8 4D premium optical system
  • IC open subsystem with dual sensors
  • Quad-output, quad-range for power on applications
  • Real image map option
  • Programmable DC power supply

TRI TR7007 series II Solder Paste Inspection Unit:

  • World’s fastest inspection speed up to 200 cm2/sec @ 15 µm
  • Shadow free Fringe Pattern lighting technology
  • Optical resolution 10 µm or 15 µm
  • Linear motor X-Y table for vibration free accurate inspection
  • Camera type: 4 MP camera
  • Optical resolution 10 µm or 15 µm (factory setting)
  • Inspection speed: up to 90 cm2/sec @ 10 µm or 200 cm2/sec @ 15 µm
  • Inspection performance
    • Height resolution: 0.4 µm
    • Min solder paste pitch: 100 µm
  • Board size 50 x 50 – 510 x 460 mm (850 x 610 mm)

AOI:

  • Vibration free ultra-high speed Inline Color AOI with precise linear motor control
  • Advanced RGB+W lighting system for improved solder and marking inspection
  • Camera type: top view 3CCD camera + 4 mono angled cameras
  • Inspection speed: 100 cm2/sec @ 15 µm and or 68 cm2/sec @ 12 µm
  • Inspection Function:
    • Component missing, tombstone, billboard, polarity, skew, marking
    • Solder joint insufficient/excess solder, bridge, Through-hole pins, lifted lead, golden finger scratch/contamination

VJ Electronix Vertex II X-ray inspection system:

  • 2D/3D high resolution micro focus x-ray system with 130kv tube
  • Inspect board up to 20″ x 20″ with 5 axis, X,Y,Z-horizontal rotate-OVHM axis
  • Digital Flat Panel Detector (in lieu of Image Intensifier & Variable Magnification Vision System) Active Area 204.8 x 204.8 mm square (>1 million pixels)Pixel Pitch: 200um
  • Image Intensifier Detector mounted on an Independent programmable X/Y stage
  • 110° Wide Angle 130kV source, Provides up to +/- 50 deg Off Axis Viewing
  • ADE: Automated Defect Enhancement Software Module
  • 3D computed tomography software for image intensifier

SMT Capabilities

POST SMT

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