Our engineering team has developed a revolutionary wrap plating process that produces excellent via reliability. These via structures pass 500 cycles with zero change in resistance.
In combination of our pinless lamination system and x-ray process, Gorilla is capable of layer-to-layer registration less than .0007”. Registration is the most critical aspect of building high layer multi-site .3mm boards. Our precise optical lay-up, alignment and welding of multilayers eliminates the added tolerances associated with pin lamination.APPLY HERE
75:1 Aspect Ratio with Sintering... BENCH MARKED
Through Gorilla’s proprietary Sintering process, our engineers are able to connect small vias through thick boards. In this example, we have a .35mm pitch with a .004” drill through a .300” thick board, using 3 transition layers.
Gorilla’s arsenal consists of the latest state-of-the-art Dual UV/CO2 Hitachi drilling system. This drill paired with our proprietary Gorilla wrap plating process, defines a new level of capability and reliability in the industry.
1. UV Laser: Removes Cu from panel surface
2. CO2 Laser: Removes laminate material in the blind hold and is then impeded by the target layer.
3. UV Clean: This UV Clean shot removes in laminate residue left behind from the CO2 laser process and provides a shiny and rough surface on the target pad that improves adhesion.
SEAMLESS PROTOTYPE TO PRODUCTION
Gorilla Circuits forged a business partnership with Taiwan based New Asia Circuits (NAC) in 2004. Gorilla is the exclusive Sales, Engineering, and Field Quality support for NAC in North America and Europe.