Fabrication

Capabilities

Capabilities

  • I/L trace width .5oz Cu .0025”
  • I/L trace to trace space .5oz Cu .002”
  • Up to 60 layers
  • .325” max thickness
  • Maximum board size 22.5” x 28.5”
  • 34:1 Aspect Ratio (.006” diameter / .200” thick)
  • 75:1 Aspect Ratio using Sintering Technology
  • Fine Pitch Back-drilling down to .35mm Pitch
  • 2.5mil Minimum Laser Micro Via
  • 3mil Minimum Mechanical Drill up to 30 mil thickness
  • 0.3 mm Pitch on ATE, Daughter Cards, & Motherboards
  • 3mils per inch warp & twist on balanced constructions
  • 5% Impedance Control Tolerance
  • Maximum 5 Lamination Cycles
  • HDI Build-up to 4+N+4
  • Via-in-Pad - Non-Conductive & Copper Fill

Electroless CU

Schmoll Mechanical

Hitachi Laser

PCB Fabrication Tour

San Jose, CA

Micro Vu

Lead Times

Single lamination:

  • Standard: 7-10 days
  • Expedite: 1-3 days

Dual lam / Via fill:

  • Standard 13 days
  • Expedite: 5-7 days

3+ laminations:

  • Standard: 20 days
  • Expedite: 12 days

Let’s Build Something Incredible!