Fabrication Resources

Copper Weights

• Contact Gorilla Circuits Engineering if you require materials with copper weights greater than 4 oz’s

Board Thickness

• Allowable Board Thickness Range: 0.010” – 0.330”
o Engineering approval required for board thickness out of approved range.

Soldermask Capabilities

• Soldermask Minimum Webbing and Clearance Capabilities
(a) Other colors default to maximum web and dam in this table. (b) Minimum Soldermask Clearance Edge to Copper (c) Gorilla Circuits is unable to guarantee the (white) pigment retention of its White Soldermask when exclusively paired with ENIG. Soldermask may discolor into a pinkish/purple. This discoloration is purely aesthetic and does not affect the integrity of the Soldermask or PCB.

Legend Capabilities

Legend Dimension Capabilities

Traces and Geometry

• Etch Compensation factor is the difference in plotted trace width and the finished trace width after it has been etched • Geometry factor is used to correctly model the shaped of the traced once it has been etched

Inner and Outer Layers: Feature Resolution and Etching Capabilities

Feature Capabilities for Inner and Outer Layers (Finished Dimensions)

Print & Etch and Print & Plate
[For Sub-Lams]: Feature Capabilities

Feature Capabilities for Image Types (finished Dimensions

Plated and Non-Plated Holes

Manufacturing capabilities

Countersink Holes

Manufacturing capabilities

Routing and Fabrication

• Default routing tolerance = +/- 0.005" • Maximum panel thickness for tab rout process is 0.100"

Scoring, Castellations, & Beveling

• Default scoring dimensions tolerance is +/- 0.010"
• Maximum Panel Dimension shall be no larger than 24"
• Maximum panel thickness for scoring+ 0.125"

• Minimum drilled hole size for castellation = 0.0217"
• Castellation radius tolerance = +/- 0.003"

Via Fill Capabilities

Customer Design for Manufacturability Via Fill Capabilities