Assembly

Printed Circuit Boards assembled in San Jose, California

Printed Circuit Board Assembly

Overview

100% 3D X-ray Inspection after SMT and at Final QA on every leadless part to ensure no shorts, opens, or voids are present
Content 100% Inline AOI ensures no errors with parts placement, mis-alignment, mis-orientation, and solder joint defects
12 zone ovens with on-demand Liquid Nitrogen for 99.99% purity on solder joints
Dual wave and Selective wave Soldering Machines
100% Inline Solder Paste Inspection
First article QA Inspection done on every job
Flying Probe Test
Parametric Bench Test

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Quick-Turn Capabilities

SPI and AOI

X-ray and Flying Probe

Gorilla Circuits provides excellent lead time capability for Printed Circuit Board Assembly. We have eliminated all line-down time though a streamlined process that is enabled through parts procurement, programming and the ability to set up multiple jobs offline with Fuji’s revolutionary feeder carts.

Gorilla Circuits performs 100% Automated Optical Inspection on every assembly to detect any errors that may result from incorrect parts placement, misalignment, improper orientation or solder joint defects. We use the TR7007 SII, which offers the fastest Solder Paste Inspection system in the industry at speeds of 200 cm2/second.

100% X-ray inspection is always done twice; first at SMT stage and again at FQA stage, on every leadless device to ensure the absence of shorts, opens and voids.

Virtual Tour

Capabilities

State-of-the-art 35k sq/ft facility in San Jose
24 Hour builds available
Front end engineering services for DFM review
12 Zone Ovens with ON-Demand Liquid Nitrogen for 99.99% purity on solder joints
Conformal Coatings for Aerospace, Military, Medical and Industrial Applications

Lead Times

Standard leads times range from 3-5 Days
24 Hour expedites are available

Parts Procurement & Inventory

Parts Procurement team and Parts Inventory available
Complimentary climate-controlled Inventory Storage available for all customers
Gorilla's own component procurement team available for BOM sourcing

FUJI Pick and Place

Gorilla Quality is certified ISO 9001 and AS9100

Quality Assurance

100% Inline Solder Paste Inspection
First Article QA inspection done on every job
Flying Probe Test
Parametric Bench Test
100% 3D Xray Inspection after SMT and at Final QA on every leadless part to insure no shorts, opens or voids are present
100% Inline AOI insures no errors with parts placement, mis-alignment, mis-orientation, and solder joint defects
Review our industry standard certifications here

Solder Paste Inspection

SEICA Test Solutions Pilot V8 4D:

Maximum board size 30″ x 30″
Configured with 4 probes front side and 4 rear side moving probes
TOS SEICA Pilot V8 4D premium optical system
IC open subsystem with dual sensors
Quad-output, quad-range for power on applications
Real image map option
Programmable DC power supply

TRI TR7007 series II Solder Paste Inspection Unit:

World’s fastest inspection speed up to 200 cm2/sec @ 15 µm
Shadow free Fringe Pattern lighting technology
Optical resolution 10 µm or 15 µm
Linear motor X-Y table for vibration free accurate inspection
Camera type: 4 MP camera
Optical resolution 10 µm or 15 µm (factory setting)
Inspection speed: up to 90 cm2/sec @ 10 µm or 200 cm2/sec @ 15 µm
Inspection performance
- Height resolution: 0.4 µm
- Min solder paste pitch: 100 µm
Board size 50 x 50 – 510 x 460 mm (850 x 610 mm)

AOI (Automated Optical Inspection):

Vibration free ultra-high speed Inline Color AOI with precise linear motor control
Advanced RGB+W lighting system for improved solder and marking inspection
Camera type: top view 3CCD camera + 4 mono angled cameras
Inspection speed: 100 cm2/sec @ 15 µm and or 68 cm2/sec @ 12 µm
Inspection Function:
- Component missing, tombstone, billboard, polarity, skew, marking
- Solder joint insufficient/excess solder, bridge, Through-hole pins, lifted lead, golden finger scratch/contamination

VJ Electronix Vertex II X-ray inspection system:

2D/3D high resolution micro focus x-ray system with 130kv tube
Inspect board up to 20″ x 20″ with 5 axis, X,Y,Z-horizontal rotate-OVHM axis
Digital Flat Panel Detector (in lieu of Image Intensifier & Variable Magnification Vision System) Active Area 204.8 x 204.8 mm square (>1 million pixels)Pixel Pitch: 200um
Image Intensifier Detector mounted on an Independent programmable X/Y stage
110° Wide Angle 130kV source, Provides up to +/- 50 deg Off Axis Viewing
ADE: Automated Defect Enhancement Software Module
3D computed tomography software for image intensifier

SMT Capabilities