PCB Fabrication Capabilities of Gorilla Circuits

Fabrication Capabilities

PCB Fabrication Capabilities

  • I/L trace width .5oz Cu .0025”
  • I/L trace to trace space .5oz Cu .002”
  • Up to 60 layers
  • .325” max thickness
  • Maximum board size 22.5” x 28.5”
  • 34:1 Aspect Ratio (.006” diameter / .200” thick)
  • 75:1 Aspect Ratio using Sintering Technology
  • Fine Pitch Back-drilling down to .35mm Pitch
  • 2.5mil Minimum Laser Micro Via
  • 3mil Minimum Mechanical Drill up to 30 mil thickness
  • 0.3 mm Pitch on ATE, Daughter Cards, & Motherboards
  • 3mils per inch warp & twist on balanced constructions
  • 5% Impedance Control Tolerance
  • Maximum 5 Lamination Cycles
  • HDI Build-up to 4+N+4
  • Via-in-Pad - Non-Conductive & Copper Fill

Electroless CU

Schmoll Mechanical

Hitachi Laser

PCB Fabrication Tour

San Jose, CA

PCB Fabrication

Lead Times

Single lamination:

Standard: 15 Days

Expedite: 3-12 Days

Via fill (Via in Pad):

Standard 20 Days

Expedite: 8-15 Days

Multiple laminations:

Approximately 5 Days for each additional lam

Micro Vu

Let’s Build Something Incredible!

Upload Files