I/L trace width .5oz Cu .0025”
I/L trace to trace space .5oz Cu .002”
Up to 60 layers
.325” max thickness
Maximum board size 22.5” x 28.5”
34:1 Aspect Ratio (.006” diameter / .200” thick)
75:1 Aspect Ratio using Sintering Technology
Fine Pitch Back-drilling down to .35mm Pitch
2.5mil Minimum Laser Micro Via
3mil Minimum Mechanical Drill up to 30 mil thickness
0.3 mm Pitch on ATE, Daughter Cards, & Motherboards
3mils per inch warp & twist on balanced constructions
5% Impedance Control Tolerance
Maximum 5 Lamination Cycles
HDI Build-up to 4+N+4
Via-in-Pad - Non-Conductive & Copper Fill
