In combination of our pin-less lamination system and x-ray process, Gorilla is capable of layer-to-layer registration less than .0007”. Registration is the most critical aspect of building high layer multi-site .3mm boards. Our precise optical lay-up, alignment and welding of multilayers eliminates the added tolerances associated with pin lamination.
Our engineering team has developed a revolutionary wrap plating process that produces excellent via reliability. These via structures pass 500 cycles with zero change in resistance.
Through Gorilla’s proprietary Sintering process, our engineers are able to connect small vias through thick boards. In this example, we have a .35mm pitch with a .004” drill through a .300” thick board, using 3 transition layers.
Gorilla’s arsenal consists of the latest state-of-the-art Dual UV/CO2 Hitachi drilling system. This drill paired with our proprietary Gorilla wrap plating process, defines a new level of capability and reliability in the industry.
An unmatched solution to maximize the effectiveness of Thermal Vias. This technology offers a superior alternative to Conductive Via Fill and eliminates the need for Copper Coins. Conductive Via Fill materials are not nearly as conductive as copper. We generally use AE3030 when conductive fill is a must. The conductivity is 7.8 W/mK whereas the conductivity of plated copper is 386 W/mK. For many applications simply plating .0015” or .002” of copper in the holes meets the thermal requirements for the PCB. For extreme applications, we would recommend plating the through via shut. Below are 2 examples. These are .006” vias plated through an .062” thick PCB.
A majority of PCB fabrication takes place on site at our facilities in San Jose, CA. For over 15 years we have worked with a high volume business partner with Taiwan based New Asia Circuits (NAC).
Gorilla is the exclusive Sales, Engineering, and Field Quality support for NAC in North America and Europe.