Fabrication

Printed Circuit Board Fabrication
High Tech Fabrication Capabilities

Registration Perfected

In combination of our pin-less lamination system and x-ray process, Gorilla is capable of layer-to-layer registration less than .0007”. In PCB Fabrication, registration is the most critical aspect of building high layer multi-site .3mm boards. Our precise optical lay-up, alignment and welding of multilayers eliminates the added tolerances associated with pin lamination.

X-Ray Inspection
Wrapped Plating Process
Revolutionizing Printed Circuit Board Fabrication

Gorilla Wrap

Our engineering team has developed a revolutionary wrap plating process that produces excellent via reliability. These via structures pass 500 cycles with zero change in resistance.

Specialized processes for High Aspect Ratios

75:1 Aspect Ratio with Sintering... Bench Marked

Through Gorilla’s proprietary Sintering process, our engineers are able to connect small vias through thick boards. In this example, we have a .35mm pitch with a .004” drill through a .300” thick board, using 3 transition layers.

Image of Gorilla Circuit's Sintering process.
Etchback provides electrical connectivity.
Pushing your technological capabilities to the edge

Laser Vias

Gorilla’s arsenal consists of the latest state-of-the-art Dual UV/CO2 Hitachi drilling system. This drill paired with our proprietary Gorilla wrap plating process, defines a new level of capability and reliability in the industry.

  1. UV Laser: Removes Cu from panel surface
  2. CO2 Laser: Removes laminate material in the blind hold and is then impeded by the target layer.
  3. UV Clean: This UV Clean shot removes in laminate residue left behind from the CO2 laser process and provides a shiny and rough surface on the target pad that improves adhesion.
New PCB techniques for a state of the art product

Plated Shut Through Via Technology

Plated Shut Through Technologies provide an unmatched solution to maximize the effectiveness of Thermal Vias. This new technology offers a superior alternative to Conductive Via Fill and eliminates the need for Copper Coins.  Since Conductive Via Fill materials are not nearly as conductive as copper,  We generally use AE3030 when conductive fill is a must. 

The conductivity is 7.8 W/mK whereas the conductivity of plated copper is 386 W/mK.  For many applications simply plating .0015” or .002” of copper in the holes meets the thermal requirements for the PCB.  For extreme applications, we would recommend plating the through via shut. The adjacent photos are examples, these are .006” vias plated through an .062” thick PCB.

PCB Fabrication on Hitachi Machines
On site PCB Manufacturing and Assembly in San Jose, California, USA

Seamless Prototype to Production

A majority of PCB fabrication takes place on site at our facilities in San Jose, CA. For over 15 years we have worked with a high volume business partner with Taiwan based New Asia Circuits (NAC).

Gorilla is the exclusive Sales, Engineering, and Field Quality support for NAC in North America and Europe.

Let’s Build Something Incredible!