Precision Alignment: Inside Gorilla Circuits’ Post Etch Punch System Upgrade

Schmoll Maschinen Post Etch Punch

Investing in PCB production

In today’s world of ultra-complex multilayer PCBs, inner layer registration isn’t just important, it’s mission-critical. Whether we’re building boards for defense, aerospace, autonomous systems, or RF communications, even a slight misalignment can compromise performance and reliability.

At Gorilla Circuits, we don’t settle for “close enough.” That’s why we’ve invested in a Post Etch Punch upgrade with the OptiFlex II Post-Etch Punch System from Schmoll Maschinen, the latest in high-resolution alignment technology. And we’re already seeing the results—both in our process capability and in the boards we deliver.

Why Innerlayer Registration Matters

Layer shift in multilayer PCBs can lead to signal degradation, impedance mismatches, and outright failure. As PCBs become thinner and more densely packed, materials as delicate as 50μm used in HDI applications, traditional alignment methods simply can’t keep up.

That’s where the OptiFlex II comes in. This system brings next-generation capabilities that allow us to hit registration targets with unmatched precision down to less than 0.5 mil of shift between layers.

What Makes OptiFlex II Stand Out?

📷 XYPhi Optical Alignment System
With up to 8 CCD cameras and ultra-high-resolution scanning, the system captures and adjusts for target positioning in real-time.

🔍 Dual-Side Scanning & Adaptive Lighting
The OptiFlex II handles a wide range of materials and ensures each side of the inner core is aligned with exceptional accuracy.

📊 Real-Time Data Capture
Each punched core is measured, logged, and verified. If a core deviates even slightly outside our strict tolerances—it’s flagged and rejected.

📌 Pinless, Automated Punching
Eliminates mechanical variability and speeds up throughput while ensuring consistent performance.

Seeing is Believing

Here’s a look at recent PCB cross-sections from multilayer builds.

The measurements speak for themselves:

  • Every inner layer core aligned with <0.5 mil deviation

  • Top-to-bottom symmetry throughout the PCB stackup

  • Flawless performance even in the most demanding builds

These results are only possible because of the OptiFlex II’s tight control over every punch and scan cycle.

PCB Cross Section showcasing the Post Etch Punch capabilities
These measurements showcase the minimal shift between top and bottom layers for each individual core that makes up the PCB.

PCB Cross Section

Built for the Innovators

At Gorilla Circuits, we support innovators working on the bleeding edge of technology. From semiconductor tools and satellites to electric vehicles and autonomous defense platforms—our boards go into systems where failure is not an option.

With the Post Etch Punch System Upgrade of our Schmoll OptiFlex II, we’re pushing PCB fabrication beyond industry norms and setting a new standard for accuracy, reliability, and quality.

This new investment was recently featured in industry magazine I-Connect 007. 🔗 Read the full feature on I-Connect007

🦍 Experience the Gorilla difference.
📍 Built in San Jose, CA
📐 Engineered for excellence

Blog Post by Casey Willard

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